SK hynix Breaks Ground on $4 Billion Indiana HBM Plant

PUBLISHED Aug 27, 2026, 6:30 PM ET

South Korean semiconductor manufacturer SK hynix broke ground on August 27 on a four billion dollar advanced packaging and research facility at Purdue University in West Lafayette, Indiana. The plant establishes the company's first United States production hub for next-generation High Bandwidth Memory essential for artificial intelligence hardware. Scheduled to open its cleanroom by October 2028, the facility targets volume production of advanced memory chips including HBM4E by the second half of 2029. Advanced wafers shipped from South Korea will undergo packaging and testing in Indiana before delivery to major American technology firms such as Nvidia. The project is supported by up to 458 million dollars in direct federal funding and 500 million dollars in loans awarded under the CHIPS and Science Act. Federal, state, and diplomatic officials attended the groundbreaking ceremony to emphasize domestic semiconductor supply chain security and workforce development.

By Sarah Whitman | JQJO News

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