Raspberry Pi Improves Soldering Process with Sony
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Raspberry Pi's manufacturer, in collaboration with Sony, has transitioned to a simultaneous reflow soldering process for its boards. This innovative technique integrates surface-mount and through-hole soldering, eliminating the previous two-step process of manual/robotic insertion followed by wave soldering. This streamlined approach enhances efficiency and improves the robustness of solder joints, particularly on critical components like the GPIO header, Ethernet, and USB ports, impacting the production of over 60 million units.
Raspberry Pi's manufacturer, in collaboration with Sony, has transitioned to a simultaneous reflow soldering process for its boards. This innovative technique integrates surface-mount and through-hole soldering, eliminating the previous two-step process of manual/robotic insertion followed by wave soldering. This streamlined approach enhances efficiency and improves the robustness of solder joints, particularly on critical components like the GPIO header, Ethernet, and USB ports, impacting the production of over 60 million units.
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